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| TDA2170 TV VERTICAL DEFLECTION OUTPUT CIRCUIT . . . . The functions incorporated are : POWER AMPLIFIER FLYBACK GENERATOR REFERENCE VOLTAGE THERMAL PROTECTION MULTIWATT 11 (Plastic Package) DESCRIPTION The TDA2170 is a monolithic integrated circuit in 11-lead Multiwatt(R) package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Colour are B & W television receivers as well as in monitors and displays. PIN CONNECTIONS ORDER CODE : TDA2170 11 10 9 8 7 6 5 4 3 2 1 Tab connected to Pin 6 NC GND REFERENCE VOLTAGE OUTPUT STAGE SUPPLY OUTPUT GND FLYBACK GENERATOR SUPPLY VOLTAGE NON INVERTING INPUT INVERTING INPUT NC December 1992 1/7 2170-01.EPS TDA2170 BLOCK DIAGRAM +VS 4 8 5 Fly back Generator 2 Power Amplif ier 7 3 Reference Volt age Thermal Protect ion YOKE 9 6 10 SCHEMATIC DIAGRAM 7 4 D4 Q11 C1 Q10 3 Q7 2 Q1 Q2 Q4 D1 Q14 Q5 Q15 Q3 Q16 Q19 R1 D2 R2 R3 R7 R8 R9 Q17 Q22 Q6 Q9 Q8 R6 Q18 R11 D6 D7 Q13 D3 R4 D5 R5 D8 Q12 R12 8 Q20 Q21 D9 5 C2 R12 Q23 Q24 R14 Z1 R13 Q25 R15 6 10 9 R16 R17 R18 2170-03.EPS Q26 Z2 Q27 Q28 Q29 2/7 2170-02.EPS TDA2170 ABSOLUTE MAXIMUM RATINGS Symbol Vs V7 , V8 V5 V2 , V3 Io Io Io I5 I5 Ptot Tstg, Tj Supply Voltage (pin 4) Flyback Peak Voltage Voltage at Pin 5 Amplifier Input Voltage Output Peak Current (non repetitive, t = 2 msec) Output Peak Current at f = 50 Hz, t 10 sec Output Peak Current at f = 50 Hz, t > 10 sec Pin 5 DC Current at V7 < V4 Pin 5 Peak to Peak Flyback Current at f = 50 Hz, tfly 1.5 msec Total Power Dissipation at Tcase = 60 C Storage and Junction Temperature Parameter Value 35 60 + Vs + Vs - 0.5 2.5 3 2 100 3 30 - 40 to 150 V A A A mA W C 2170-01.TBL Unit V V A THERMAL DATA Rth (j-c) R th (j-a) Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max Max 3 40 C/W C/W 2170-02.TBL 2170-03.TBL Symbol Parameter Value Unit ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35 V, Tamb = 25 C unless otherwise specified) Symbol I4 I8 I3 I2 V9 V9 VS V5L V7 V7L V7H R9 Tj Parameter Pin 4 Quiescent Current Pin 8 Quiescent Current Amplifier Input Bias Current Amplifier Input Bias Current Reference Voltage Reference Voltage Drift vs. Supply Voltage Pin 5 Saturation Voltage to GND Quiescent Output Voltage Output Saturation Voltage to GND Output Saturation Voltage to Supply Reference Voltage Output Resistance Junction Temperature for Thermal Shut Down Test Conditions I5 = 0 ; I7 = 0 ; V3 = 3 V I5 = 0 ; I7 = 0 ; V3 = 3 V V3 = 1 V V2 = 1 V I9 = 0 VS = 15 to 30 V I5 = 20 mA VS = 35 V ; Ra = 13 k VS = 15 V ; Ra = 13 k I7 = 1.2 A I7 = 0.7 A - I7 = 1.2 A - I7 = 0.7 A Min. Typ. Max. 8 16 - 0.1 - 0.1 2.2 1 1 18 7.5 1 0.7 1.6 1.3 2.1 140 1.4 1 2.2 1.8 2 16 36 -1 -1 Unit mA mA A A V mV/V V V V V V V V k C Fig. 1a 1a 1a 1a 1a 1a 1c 1d 1d 1c 1c 1b 1b 3/7 TDA2170 Figure 1 : DC Test Circuits Figure 1a : Measurement of I2 ; I3 ; I4 ; I8 ; I9 ; V9/VS ; R9 Figure 1b : Measurement of V7H S1 : (a) I2 ; (b) I3, I4 and I8. S2 : (a) I4 and I8 ; (b) I3 ; (c) I2. S3 : (a) I2, I3, I4, I8, I9 and V9 ; (b) R9. Figure 1c : Measurement of V5L, V7.L. 2170-04.EPS Figure 1d : Measurement of V7. 2170-06.EPS S1 : (a) V5L ; (b) V7L. Figure 2 : Application Circuit 4/7 2170-08.EPS 2170-07.EPS 2170-05.EPS TDA2170 Figure 3 : PC Board and Component Layout (1:1 scale) COMPONENTS LIST FOR TYPICAL APPLICATIONS Component RT1 R1 R2 R3 R4 R5 R6 R7 D1 C1 C2 el. C3 el. C4 C5 el. C6 el. 110 TVC 5.9 / 10 mH 1.95 App 10 12 10 27 12 0.82 270 1.5 1N 4001 0.1 1000/25 V 220/25 V 0.22 2200/25 V 4.7/16 V 110 TVC 9.6 / 24.6 mH 1.2 App 4.7 10 5.6 12 8.2 1 330 1.5 1N 4001 0.1 470/25 V 220/25 V 0.22 2200/25 V 4.7/16 V 90 TVC 15 / 30 mH 0.82 App 10 12 5.6 18 5.6 1 330 1.5 1N 4001 0.1 470/25 V 220/25 V 0.22 1000/16 V 10/16 V Unit k k k k k - F F F F F F 2170-04.TBL 5/7 2170-09.TIF TDA2170 TYPICAL PERFORMANCES Parameter Vs - Supply Voltage Is - Current tfly - Flyback Time * Ptot - Power Dissipation * Rth c-a - Heatsink Tamb Tj max to Vi V7 * Worst case condition. 110 TVC 5.9 / 10 mH 24 280 0.6 4.2 7 60 110 20 2.5 50 110 TVC 9.6 / 27 mH 22.5 175 1 2.5 13 60 110 20 2.5 47 90 TVC 15 / 30 mH 25 125 0.7 2.05 16 60 110 20 2.5 52 Unit V mA ms W C/W C C ms VPP VP MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the MULTIWATT(R) package attaching the heatsink is very simple, a screw or a compresFigure 2 : Application Circuit sion spring (clip) being sufficient. Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces. Figure 5 : Maximum Allowable Power Dissipation versus Ambient Temperature 6/7 2170-12.EPS 2170-10.EPS / 2170-11.EPS 2170-05.TBL TDA2170 PACKAGE MECHANICAL DATA 11 PINS - PLASTIC MULTIWATT H1 A C L7 S S1 Dia. 1 L3 L2 L4 L1 L D H2 B E F M1 M G1 G PMMUL11V.EPS Dimensions A B C E F G G1 H1 H2 L L1 L2 L3 L4 L7 M M1 S S1 Dia. 1 Min. Millimeters Typ. 0.49 0.88 1.57 16.87 19.6 21.5 21.4 17.4 17.25 10.3 2.65 4.1 4.88 1.9 1.9 3.65 1.7 17 Max. 5 2.65 1.6 0.55 0.95 1.83 17.13 20.2 22.3 22.2 18.1 17.75 10.9 2.9 4.5 5.3 2.6 2.6 3.85 Min. Inches Typ. 0.019 0.035 0.062 0.664 0.772 0.846 0.843 0.685 0.679 0.406 0.104 0.161 0.192 0.075 0.075 0.144 0.067 0.669 Max. 0.197 0.104 0.063 0.022 0.037 0.072 0.674 0.795 0.878 0.874 0.713 0.699 0.429 0.114 0.177 0.209 0.102 0.102 0.152 17.5 10.7 4.3 5.08 0.689 0.421 0.169 0.200 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 7/7 MUL11V.TBL |
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